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Quectel showcases industrial smart color sorter solution with edge intelligence at Embedded World 2023

Nuremberg, 14 March 2023 –  Quectel Wireless Solutions, a global IoT solutions provider, today announces  how its latest smart module with machine compute and edge intelligence  capabilities is revolutionizing the color sorter industry with higher  efficiency and accuracy. Employing Quectel’s high performance SG560D  smart module, the solution improves the color sorting of industrial materials  that can be transformed via a visual identification system, through a  combination of machine vision and edge intelligence capabilities, and  automatically sort objects based on color and shapes  accordingly.

The advanced color sorter application, aimed at the industrial  materials management industry, utilizes the Quectel SG560D smart module based  on the Qualcomm  QCS6490 chipset, and additional integrated hardware including  cameras, lamps, and air guns. The solution is able to detect, recognize, and  sort a broad array of textures, colors and materials including food materials  such as rice, wheat, corn, soybean, seeds, nuts, salt, plastic objects such  as plastic pieces, plastic granules, plastic bottle cap flake as well as  minerals like quartz stone, quartz sand, pearls, marble, and  others.

“As a global leader, Quectel is committed to serving our  customers across all industries with the latest innovative technologies. We  are proud to drive innovations in large industrial verticals such as color  sorting where machine vision, edge computing and next-generation robotics  applications can transform entire industries with faster time-to-market,  increase productivity and produce significant cost-savings.” said Norbert  Muhrer, President and CSO, Quectel Wireless Solutions.

Quectel AI color sorter

With advanced visual identification system, the  smart color sorter solution can manage color sorting of high-volume objects  with four cameras working simultaneously to stream video, with an accuracy of  less than 1/200000 error rate. Additionally, it can help reduce operating and  labor expense significantly.

Quectel’s SG560D is a powerful smart module  equipped with a Qualcomm® Kryo™ 670 CPU built on Arm v8 Cortex technology and  a Qualcomm® Adreno™ 642L GPU. It also features 2 x HVX high-performance  digital signal processing (DSP), which bring superior computing power to  enable fast, high-quality data processing and make quicker, data-driven  decisions. Tests indicate that the SG560D module can achieve computing  performance of up to 14 trillion operations per second  (TOPS).

The SG560D also supports 5G new radio (NR), Wi-Fi 6E bands of  2.4GHz, 5GHz and 6GHz, dual-band simultaneous (DBS), Wi-Fi 2×2 MU-MIMO and  Bluetooth 5.2, which significantly improves network coverage and enhances  transmission data rates in different application scenarios.

To learn more, visit  the Quectel  booth at Embedded World 2023, Hall 3, Booth 318 where we will be  demonstrating Quectel’s smart module solutions with machine vision and edge  capabilities.

About  Quectel 

Quectel’s passion for a smarter world drives us  to accelerate IoT innovation. A highly customer-centric organization, we are  a global IoT solutions provider backed by outstanding support and  services.

Our growing global team of over 4,000 professionals sets the  pace for innovation in cellularGNSSWi-Fi  and Bluetooth modules, antennas and services.

With regional offices  and support across the globe, our international leadership is devoted to  advancing IoT and helping build a smarter world.

For more  information: www.quectel.comLinkedInFacebook, and Twitter.

Media  Contact  

Phil Rawcliffe, Head of  Communications 
phil.rawcliffe@quectel.com