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5G SG560D Smart Module series

  • Summary
  • Specifications
  • PCB
    • 5G sub-6GHz LGA smart module
    • 42.5mm × 56.5mm × 2.95mm
    • 17.5g
    • LGA package
    • Max. downlink 2.5Gbps / 900Mbps uplink
    • Extended temperature range of -35°C to +75°C

  • Download Product Specifications

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