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Wi-Fi & Bluetooth FCM740D

  • MCU Wi-Fi 4 & BLE 5.2 module
  •  DIP+LCC form factor
  • 20.3 mm × 15.8 mm × 2.7 mm
  • 1.06 g
  • Operating temperature range: -40°C to +105°C
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Key features

  • Wi-Fi 4 module, single band (2.4 GHz) Wi-Fi, 1 × 1 antenna
  • PCB antenna or 1st RF coaxial connector
  • BLE 5.2 and Wi-Fi pairing via Bluetooth
  • Large memory, 256 KB SRAM and 4 MB flash
  • Wide operating temperature range: -40°C to +105°C
  • High stability, high reliability and full compatibility


FCM740D is a cutting-edge MCU Wi-Fi and Bluetooth module launched by Quectel. It boasts a high-performance processor with a frequency of up to 120MHz and supports IEEE 802.11b/g/n protocol and BLE 5.2. The module features built-in 256 KB SRAM and 4 MB flash, ensuring efficient performance. In addition, it complies with WPA-PSK, WPA2-PSK and WPA3-SAE security standards. FCM740D has an LCC + DIP form factor with an ultra-compact size of 20.3 mm × 15.8 mm × 2.7 mm, which optimizes the size and cost for end-products and is compatible with diverse designs.

The module supports UART and GPIO interfaces by default. In the case of multiplexing, it can support PWM and ADC etc. With a variety of low-power modes and long connection keep-alive mechanisms, it can be flexibly and widely used in smart home, industrial IoT, consumer electronics and other application scenarios to meet various product needs. It is especially suitable for small-sized smart lighting and other applications. IoT devices with high temperature, such as light bulbs, light strips, smart sockets. FCM740D supports the QuecOpen® solution and standard AT commands, has a compact protocol stack, which can realize efficient product development for customers.

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