Wi-Fi & Bluetooth FCM100D
- Wi-Fi & Bluetooth 5.2 module
- LCC form factor
- 24.0mm × 16.0mm × 2.6mm
- 1.55g
- Operating temperature range: -40°C to +85°C / -40°C to +105°C (optional)
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Key features
- Support Bluetooth 5.2
- Support Wi-Fi (2.4 GHz), 1 × 1 SISO
- Easier soldering and testing process with LCC package
- Faster time-to-market: simple design minimizes design-in time and development efforts
- Supports pin antenna, IPEX antenna, and PCB antenna (optional)
Overview
FCM100D is a cutting-edge MCU Wi-Fi and Bluetooth module launched by Quectel. It boasts a high-performance processor with a frequency of up to 120 MHz and supports IEEE 802.11b/g/n protocol and Bluetooth 5.2. The module features built-in 256 KB RAM and 2 MB/4 MB flash, ensuring efficient performance. In addition, it complies with WPA-PSK, WPA2-PSK and WPA3-SAE security standards.
FCM100D is in a LCC form factor with an ultra-compact package size of 24.0 mm × 16.0 mm × 2.6 mm, which optimizes the size and cost for end-products and is compatible with diverse designs.
FCM100D supports multiple interfaces including UART, GPIO, ADC, I2C and PWM, and many low power consumption modes and keep-alive mechanism, which provide flexibility and versatility for a range of applications, especially in smart homes and industrial IoT scenarios.
FCM100D supports the QuecOpen® solution and standard AT commands, has a compact protocol stack. FCM100D supports a variety of public cloud services, and can realize efficient product development for customers.
Simplify deployment by sourcing antennas at the same time as your modules – see our wide range here
Product Brochure
Quectel-Product-Brochure-V7.7.pdf
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