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5G & C-V2X AG57xQ automotive module series

  • Automotive grade 5G NR + C-V2X/DSDA module
  • 54.5mm × 53.0mm × 3.45mm
  • LGA form factor
  • Max. downlink 2.4Gbps / uplink rates of 550Mbps under 5G NR
  • Max. downlink 1.2 Gbps / uplink rates of 100Mbps under LTE-A
  • Extended temperature range of -40°C to +85°C
  • eCall temperature (up to +95 °C)
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Key features

  • Compliant with IATF 16949 and automotive quality processes such as APQP and PPAP
  • Based on AEC-Q100 qualified Qualcomm SA515Mchipset
  • Automotive 5G NR module with 4G/3G/2G fallback, supporting both 5G NR NSA and SA modes
  • MIMO technology in line with data rate and link reliability demands
  • Optional C-V2X PC5 Mode 4 direct communications
  • A great variety of navigation solutions (single or dual-frequency GNSS, PPE (RTK), QDR 3.0 integrated navigation, etc.) ensure fast and accurate positioning in any environment
  • Optional DSDA for flexible user-oriented applications
  • Feature refinements: DFOTA, VoLTE, QuecOpen®, High Security, etc.
  • Wide operating temperature range (-40 °C to +85 °C) and high eCall operating temperature (up to +95 °C) meet the demanding requirements for automotive devices
  • Excellent EMI protection makes the module operate satisfactorily in harsh environments


AG57xQ is a family of Quectel’s automotive grade 5G NR Sub-6 GHz modules, supporting both 5G NR NSA and SA modes. Adopting 3GPP Rel-15 technology, the module supports maximum 2.4 Gbps downlink and 550 Mbps uplink data rates at 5G NSA mode, and maximum 1.2 Gbps downlink and 100 Mbps uplink data rates at LTE-A. Optional PC5-based C-V2X direct communications make AG57xQ family a great solution for automotive applications since it makes traffic smoother and more efficient by paving the way for automated driving and fully connected traffic. The module supports DSDA (optional) and provides abundant interfaces for developing customer applications. Its excellent performance in ESD and EMI protection ensures great robustness in harsh environments.

AG57xQ family consists of AG570Q (5G + DSSS + C-V2X), AG571Q (5G + DSSS), AG572Q (5G + DSDA) and AG573Q (5G + DSDA + C-V2X) series, each of which contains multiple modules (AG57xQ-CN, AG57xQ-EU, AG57xQ-NA and AG57xQ-ROW) to meet varied market demands. It is backward compatible with existing GSM, UMTS and LTE networks, enabling connectivity in areas without 5G NR deployment currently and even remote areas devoid of 3G or 4G coverage.

AG57xQ family supports multiple input multiple output (MIMO) technology. Using multiple antennas at the transmitting and receiving ends at the same time in the same frequency band greatly reduces errors and optimizes data speed. While supporting multi-constellation GNSS (GPS, GLONASS, BDS, Galileo, QZSS) based on Qualcomm® IZat™ location technology Gen9VT Lite, the module can also support dual-frequency GNSS, PPE (RTK) and QDR 3.0 integrated navigation solutions. This greatly simplifies product design and enables quicker, more accurate and more dependable positioning.

With AG57xQ family, we provide automotive OEMs and tier-1 suppliers with secure and reliable connected car solutions, and vehicle manufacturers with smart and flexible solutions to build self-driving cars. More specifically, the module is commonly used in telematics boxes (T-Box), telematics control units (TCU), advanced driver-assistance systems (ADAS), C-V2X (V2V, V2I, V2P) systems, on-board units (OBU), roadside units (RSU), and other automotive/traffic systems.

Simplify deployment by sourcing antennas at the same time as your modules – see our wide range here

Product Brochure



Documentation and resources

  • Quectel_Automotive_Windows_USB_Driver(Q)_V1.2_EN

    21.37 MB

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