Overview

FLM163D is a cutting-edge MCU Wi-Fi 6 and Bluetooth module launched by Quectel. It has a built-in 32-bit RISC-V processor with a frequency of up to 320MHz and supports IEEE 802.11b/g/n/ax protocol and BLE 5.2. The module features built-in 512KB SRAM and 4MB flash, complies with WPA-PSK, WPA2-PSK, and WPA3-SAE security standards, integrates the Mbed TLS encryption library, and supports the secure boot security startup mechanism.

FLM163D is in a DIP form factor with an ultra-compact size of 17.9mm × 15.0mm × 2.8mm, which optimizes the size and cost for end-products and is compatible with diverse designs.

FLM163D provides 8 GPIO interfaces, which can be multiplexed as UART, PWM, I2C, ADC and other interfaces. It has an operating temperature of – 40℃ ~ +85 ℃ and is suitable for smart devices such as sockets and converters.

FLM163D integrates the ACK SDK for Matter solution, which enables terminal products to quickly and efficiently access the Amazon Alexa platform and can be interconnected with other smart devices that support the Matter protocol.