Wi-Fi & Bluetooth FGM840R
- Wi-Fi 4 dual-band and BLE 5.0 module
- LGA form factor
- 12.5 mm × 13.2 mm × 2.05 mm
- Operating temperature: -40 °C to +85 °C
- Storage temperature: -45 °C to +95 °C
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Key features
- Wi-Fi 4 module, 2.4 GHz and 5 GHz Wi-Fi bands, 1 × 1 antenna
- BLE 5.0 and Wi-Fi pairing via Bluetooth
- Built-in 512 KB SRAM, 4MB flash
- Supports IEEE 802.11 a/b/g/n
- Supports up to 20 GPIOs for UART, SPI, I2C, ADC, PWM, SDIO and USB functions in QuecOpen® solution
- RF coaxial connector or pin antenna interface (optional)
- Wide operating temperature range: -40 °C to + 85 °C
- USB Ethernet access solution
Overview
FGM840R is a cutting-edge MCU Wi-Fi 4 and Bluetooth combo module launched by Quectel. It has a built-in Cortex M33 and M23 dual-core processor with a main-core frequency of up to 200 MHz. It supports IEEE 802.11a/b/g/n protocol and BLE 5.0, supports 2.4 GHz and 5 GHz frequency bands, and has built-in 512 KB RAM and 4 MB flash to meet the needs of high-speed data processing.
The module is in an LGA form factor with an ultra-compact package size of 12.5 mm × 13.2 mm × 2.05 mm, which optimizes the size and cost for end-products and is compatible with diverse designs.
The module complies with WPA-PSK, WPA2-PSK and WPA3-SAE security standards, supports comprehensive security such as TRNG (true random number generator), AES-128, TrustZone, Secure Boot and flash encryption.
In QuecOpen® solution, the module supports up to 20 GPIO interfaces, which can be multiplexed as UART, SPI, I2C, ADC, PWM, SDIO and USB functions, which provide flexibility and versatility for a range of applications, especially in smart homes and industrial IoT scenarios.
The module supports QuecOpen® solution and standard AT commands, with a compact protocol, and can realize efficient product development for customers.
