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SP900BF-AP smart module

  • Next-generation flagship smart module
  • Ubuntu/Yocto Linux
  • LGA package
  • 65 mm × 65 mm × 4.55 mm
  • Operating temperature range of -40°C ~ +85°C
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Key features

  • 4 × Kryo Gold Prime @ 2.36GHz + 4 × Kryo Gold Prime @ 2.36GHz
  • Adreno 663 GPU
  • Hexagon DSP + Hexagon Vector eXtensions (HVX) + Hexagon Matrix eXtensions (HMX)
  • Spectra ISP
  • Adreno 765 VPU
  • Adreno DPU 1199
  • Neural processing unit
  • Secure processing unit
  • Video encoding: 4K @ 120fps
  • Video decoding: 4K @ 240fps
  • Up to 100 TOPS AI compute performance

Overview

The SP900BF-AP is Quectel’s next-generation flagship Ubuntu/Yocto Linux smart module powered by Qualcomm’s flagship IoT chipset, the IQ9075. The module integrates an up-to-octacore high-performance Kryo™ CPU, Adreno™ 663 GPU, Adreno DPU 1199, Adreno 765 VPU, Hexagon™ DSP, and Spectra™ ISP. Delivering high compute power and rich multimedia capabilities, it meets demanding customer requirements for edge computing, high-throughput processing, and advanced multimedia features across both industrial and consumer applications.

In addition, the SP900BF-AP provides a comprehensive array of peripheral interfaces, including LCM, camera, touch screen, I2S, PCIe, UART, USB, I2C, and SPI. This extensive connectivity significantly expands its versatility in machine-to-machine (M2M) deployments, making it ideal for use in end devices and vertical markets such as edge gateways, edge AI boxes, drones, robotics, and industrial PCs.

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Product Brochure

Quectel_Product_Brochure_V8.6.pdf

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