SP900BF-AP smart module
- Next-generation flagship smart module
- Ubuntu/Yocto Linux
- LGA package
- 65 mm × 65 mm × 4.55 mm
- Operating temperature range of -40°C ~ +85°C
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Key features
- 4 × Kryo Gold Prime @ 2.36GHz + 4 × Kryo Gold Prime @ 2.36GHz
- Adreno 663 GPU
- Hexagon DSP + Hexagon Vector eXtensions (HVX) + Hexagon Matrix eXtensions (HMX)
- Spectra ISP
- Adreno 765 VPU
- Adreno DPU 1199
- Neural processing unit
- Secure processing unit
- Video encoding: 4K @ 120fps
- Video decoding: 4K @ 240fps
- Up to 100 TOPS AI compute performance
Overview
The SP900BF-AP is Quectel’s next-generation flagship Ubuntu/Yocto Linux smart module powered by Qualcomm’s flagship IoT chipset, the IQ9075. The module integrates an up-to-octacore high-performance Kryo™ CPU, Adreno™ 663 GPU, Adreno DPU 1199, Adreno 765 VPU, Hexagon™ DSP, and Spectra™ ISP. Delivering high compute power and rich multimedia capabilities, it meets demanding customer requirements for edge computing, high-throughput processing, and advanced multimedia features across both industrial and consumer applications.
In addition, the SP900BF-AP provides a comprehensive array of peripheral interfaces, including LCM, camera, touch screen, I2S, PCIe, UART, USB, I2C, and SPI. This extensive connectivity significantly expands its versatility in machine-to-machine (M2M) deployments, making it ideal for use in end devices and vertical markets such as edge gateways, edge AI boxes, drones, robotics, and industrial PCs.
Product Brochure
Quectel_Product_Brochure_V8.6.pdf
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