MCU Wi-Fi 6/6E & BLE 5.4 FGMC62N & FGMC63N
- Wi-Fi 6/6E and BLE 5.4 module
- LGA form factor
- Dimensions: 16.0 mm x 13.0 mm x 1.7 mm
- Approx. 0.76 g
- Operating temperature range: -40 °C to +85 °C
- Storage temperature range: -45 °C to +95 °C
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Key features
- Wi-Fi 2.4 GHz/ 5 GHz/ 6 GHz, 1 x 1 antenna
- Bluetooth Low Energy (BLE 5.4)
- Large memory: 768 KB SRAM, 2 MB ROM, and 4 MB flash
- Supports up to 48 GPIOs forSDIO, UART, SPI*, I2C*, TDM* PWM*, ADC*, DMIC* and Analog MIC* interfaces in open solution
- Wide operating temperature: -40 °C to +85 °C
Overview
The FGMC62N and FGMC63N are cutting-edge MCU Wi-Fi 6/6E and BLE 5.4 modules launched by Quectel. The modules boast a high-performance processor (ARM Cortex-M33) with a frequency of up to 192 MHz and support IEEE 802.11a/b/g/n/ac/ax and BLE 5.4 protocols. The modules feature built-in 768 KB SRAM, 2 MB ROM and 4MB flash, ensuring efficient performance. In addition, they comply with WPA, WPA2, and WPA3 security standards.
The FGMC62N and FGMC63N are in LGA form factor, with the ultra-compact package size of 16.0 mm x 13.0 mm x 1.7 mm, which optimizes the size and cost for end-products and is compatible with diverse designs.
The modules support up to 48 GPIOs in open solution, which can be multiplexed into interfaces such as SDIO, UART, SPI*, I2C*, TDM*, PWM*, ADC*, DMIC* and Analog MIC*, and many low power consumption modes and keep-alive mechanisms, which provides flexibility and versatility for a range of applications, especially in smart homes and industrial IoT scenarios.
The modules support open solution and standard AT commands, with a compact protocol, and can realize efficient product development for customers.
Simplify deployment by sourcing antennas at the same time as your modules – see our wide range here
Product Brochure
Quectel_Product_Brochure_V8.4.pdf
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