MCU Wi-Fi 6/6E & BLE 5.4 FGMC62N & FGMC63N
- Wi-Fi 6/6E and BLE 5.4 module
- LGA form factor
- Dimensions: 16.0 mm x 13.0 mm x 1.9 mm
- Approx. 0.76 g
- Operating temperature range: -40 °C to +85 °C
- Storage temperature range: -45 °C to +95 °C
Have a question? Contact us
Key features
- Wi-Fi 2.4 GHz/ 5 GHz/ 6 GHz, 1 x 1 antenna
- Bluetooth Low Energy (BLE 5.4)
- Large memory: 768 KB SRAM, 2 MB ROM, and 4 MB flash
- Supports up to 48 GPIOs for SDIO, UART, SPI, I2C, I2S and PWM interfaces in open solution
- Wide operating temperature: -40 °C to +85 °C
Overview
The FGMC62N and FGMC63N are cutting-edge MCU Wi-Fi 6/6E and BLE 5.4 modules launched by Quectel. The modules boast a high-performance processor (ARM Cortex-M33) with a frequency of up to 192 MHz and support IEEE 802.11a/b/g/n/ac/ax and BLE 5.4 protocols. The modules feature built-in 768 KB SRAM, 2 MB ROM and 4MB flash, ensuring efficient performance. In addition, they comply with WPA-PSK, WPA2-PSK, and WPA3-SAE security standards, providing an AES-128 encryption algorithm.
The FGMC62N and FGMC63N are in LGA form factor, with the ultra-compact package size of 16.0 mm x 13.0 mm x 1.9 mm, which optimizes the size and cost for end-products and is compatible with diverse designs.
The modules support up to 48 GPIOs in open solution, which can be multiplexed into interfaces such as SDIO, UART, SPI, I2C and PWM, and many low power consumption modes and keep-alive mechanisms, which provides flexibility and versatility for a range of applications, especially in smart homes and industrial IoT scenarios.
The modules support open solution and standard AT commands, with a compact protocol, and can realize efficient product development for customers.
Simplify deployment by sourcing antennas at the same time as your modules – see our wide range here
Product Brochure
Quectel_Product_Brochure_V8.4.pdf
Download