MCU Bluetooth HCM213S
- BLE 6.0 module
- LCC form factor
- 18.0 mm x 18.0 mm x 2.4 mm
- Operating temperature of -40 °C to +105 °C
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Key features
- BLE 6.0 (Channel Sounding Support) and BLE mesh
- Ultra-low power, suitable for battery-powered devices
- 256 KB SRAM and 1 MB/ 2 MB flash (optional)
- 26 GPIOs which can be multiplexed for various interfaces including I2C, UART, SPI, and I2S functions
- Operating temperature range: -40 °C to +105 °C
- 2 x 1st generation RF coaxial connector
Overview
HCM213S is a high-performance MCU BLE module by Quectel. It boasts an ARM Cortex-M33 processor with a
frequency of up to 78 MHz and a Cortex-M0 processor for radio, which supports BLE 6.0 and BLE mesh. The
module features built-in 256 KB SRAM and 1 MB/ 2 MB flash, ensuring efficient performance. And it offers an
enhanced security option, Secure Vault, featuring a higher level of IoT security.
HCM213S is in an LCC form factor with a compact size, which optimizes the size and cost for end-products and is
compatible with diverse designs.
HCM213S can support up to 26 GPIOs in the case of multiplexing, which can be used for interfaces including I2C,
UART, SPI, I2S, etc. It supports low power features which is suitable for battery powered devices, such as door
locks, smart plugs, lighting, remote controls, etc. It also features a superior sensitivity of -97.6 dBm and a transmit
power of up to +19.5 dBm, providing flexibility and versatility for a range of applications.
Product Brochure
Quectel_Product_Brochure_V8.5_2026.pdf
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