MCU Bluetooth HCM213S
- BLE 6.0 module
- LCC form factor
- 18.0mm x 18.0mm x 2.4mm
- Operating temperature of -40°C to +105°C
Have a question? Contact us
Key features
- BLE 6.0 (Channel Sounding Support) and BLE mesh
- Ultra-low power, suitable for battery-powered devices
- 256KB SRAM and 1MB/2MB flash (optional)
- 26 GPIOs which can be multiplexed for various interfaces including I2C, UART, SPI, and I2S functions
- Operating temperature range: -40°C to +105°C
- 2 x 1st generation RF coaxial connector/pin antenna (optional)
Overview
The HCM213S is a high-performance MCU BLE module by Quectel. It boasts an ARM Cortex-M33 processor with a frequency of up to 78MHz and a Cortex-M0 processor for radio, which supports BLE 6.0 and BLE mesh. The module features built-in 256KB SRAM and 1MB/2MB flash, ensuring efficient performance.
The HCM213S is in LCC form factor, with a compact size, which optimizes the size and cost for end-products and is compatible with diverse designs.
The HCM213S can supports up to 26 GPIOs, which can be multiplexed for various interfaces including I2C, UART, SPI, and I2S. It also features a superior sensitivity of -97.6dBm and a transmit power of up to +19.5dBm (optional), providing flexibility and versatility for a range of applications.
The HCM213S supports low power features, which makes it suitable for battery powered devices, such as door locks, smart plugs, lighting, remote controls, etc. Furthermore, the module offers an enhanced security option, Secure Vault, featuring a higher level of IoT security.
Product Brochure
Quectel_Product_Brochure_V8.5_2026.pdf
Download