MCU Bluetooth HCM010S-E
- BLE 5.4 module
- LCC form factor
- 20.0mm × 15.6mm × 2.4mm
- 1.14g
- Operating temperature of -40°C to +105°C
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Key features
- BLE 5.4
- 64 KB SRAM and 768 KB flash
- Bluetooth Low Energy Mesh networking
- 18 GPIOs which can be multiplexed for various interfaces including I2C, UART, SPI, I2S functions
- Operating temperature range: -40°C to +105°C
- RF coaxial connector, external antenna pin, PCB antenna (optional)
Overview
HCM010S-E is a high-performance MCU Bluetooth module launched by Quectel. It boasts a ARM Cortex-M33 processor with a frequency of up to 80 MHz, and supports BLE 5.4 and BLE Mesh. The module features built-in 64 KB SRAM and 768 KB flash, ensuring efficient performance.
HCM010S-E is in a LCC + DIP form factor with an ultra-compact size of 20.0 mm × 15.6 mm × 2.4 mm, which optimizes the size and cost for end-products and is compatible with diverse designs.
HCM010S-E supports up to 18 GPIOs for I2C, UART, SPI, I2S and other functions, features an superior sensitivity of -104 dBm and transmit power of up to +20 dBm and Bluetooth low power mode, which provide flexibility and versatility for a range of applications.
HCM010S-E supports standard Bluetooth mesh networking, increasing network scalability and node counts with mesh topology, which is suitable for BLE devices that enables many-to-many communications, smart lighting, smart buildings and home smart wireless networks. And the module offers an enhanced security option, Secure Vault, featuring a higher level of IoT security
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Product Brochure
Quectel_Product_Brochure_V8.3.pdf
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