HSM110XC BLE 5.4 SIP module
- BLE 5.4 SIP module
- 6.0 mm × 6.0 mm × 0.9 mm
- LGA form factor
- Operating temperature range: -40 °C ~ +85 °C
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Key features
- BLE 5.4
- 80KB SRAM, 1 MB flash
- Operating temperature range: -40 °C to +85 °C
- Internal PCB antenna, external pin antenna (optional)
- 25 GPIOs are available in QuecOpen® solution, which can be multiplexed as interfaces such as UART, SPI, I2C, and ADC.
Overview
The HSM110XC is a low-power, cost-effective SIP Bluetooth module launched by Quectel, featuring a Cortex-M4 processor with a main frequency of up to 64 MHz. It supports the BLE 5.4 protocol and integrates 80 KB SRAM and 1 MB flash memory.
The HSM110XC adopts an LGA package with an ultra-compact size of 6.0 mm × 6.0 mm × 0.9 mm, which optimally meets the demand for small-form-factor modules in end products and is compatible with diverse structural designs.
In QuecOpen® solution, the HSM110XC supports up to 25 GPIO interfaces, which can be multiplexed as UART, SPI, I2C, ADC, and other interfaces. With support for Bluetooth low-power modes, it can be flexibly and widely applied in scenarios such as smart homes and industrial IoT, catering to various application requirements.
The HSM110XC module features exceptional ultra-low power consumption: broadcasting current consumption is as low as 10μA at a 1-second interval, and connection current consumption is as low as 7 μA at a 1-second interval. Additionally, the HSM110XC integrates 80 KB SRAM and 256-bit EFUSE, supports user-defined IDE-based system-on-chip development, and features SFLASH MCU and JTAG software upgrade functions.