Wi-Fi & Bluetooth FGE560X
- Wi-Fi 6 and Bluetooth 5.4 module
- LGA form factor
- 16.0mm × 12.0mm × 1.9mm
- Max. data rate up to 1201Mbps
- Operating temperature of -20°C to +80°C
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Key features
- 2.4GHz and 5GHz Wi-Fi bands and Bluetooth 5.4
- PCIe 2.0 interface that supports a higher data transmission rate and enables lower power consumption
- Faster time-to-market: simple design minimizes design-in time and development efforts
- Wider operating temperature range: -20°C to +80°C
Overview
The FGE560X is a high-performance Wi-Fi 6 and Bluetooth 5.4 module featuring 2T2R in LGA package. It can be used for WLAN and Bluetooth connections, delivering a maximum data rate of up to 1201Mbps.
With an ultra-compact size of 16.0mm x 12.0mm x 1.9mm, the module optimizes the size and cost for end-products, which fully meets the demands of size-sensitive applications.
Surface-mount technology (SMT) makes the module an ideal solution for durable and rugged designs. The low profile and small LGA package size ensure that the module can be easily embedded into size-constrained applications and provide reliable connectivity in these applications.
Based on the reliable PCIe 2.0 interface, the module enables high-speed, low-power WLAN wireless transmission. With its compact form factor, low power consumption, wide temperature range, and high reliability, the FGE560X is particularly suitable for laptop applications.