Overview

The FGD966X is a high-performance Wi-Fi 6, BLE 5.4, and 802.15.4 module in LGA package launched by Quectel. Under the IEEE 802.11ax standard protocol, it supports MCS 0–MCS 9 rates in a 20 MHz bandwidth with 256QAM supported. The module is designed with a reliable SDIO 3.0 and USB interface to provide WLAN capability. With an ultra-compact size of 12.0 mm × 12.0 mm × 2.0 mm, the FGD966X optimizes the size and cost for end-products, which fully meets the demands of size-sensitive applications.

Surface-mount technology (SMT) makes the FGD966X an ideal solution for durable and rugged designs. The low profile and small size of the LGA package ensure that the module can be easily embedded into size-constrained applications to provide reliable connectivity in these applications. The advanced package, integrated shielding cover and the laser-engraved label with better heat dissipation and indelible markings allow for large-scale automated manufacturing that has strict requirements on cost and efficiency. Coupled with its compact size and wide operating temperature range, the FGD966X is suitable for a variety of smart home and industrial applications.