SE200ZC-AP smart module
- New generation smart module
- Linux (Kernel 6.1*)/Debian*
- LCC + LGA form factor
- 40.0 mm × 40.0 mm × 2.9 mm
- Operating temperature (commercial): -25°C ~ +75°C
- Operating temperature (industrial): -35°C ~ +80°C
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Key features
- Quad-core ARM Cortex-A53 CPU with NEON and FPU
- 12M ISP HDR and 8M AI-ISP
- NPU up to 3 TOPS (supports mixed operation of INT4/8/16/FP16)
- Decode 4K @ 30 fps (H.265/H.264)
- Encode 4K @ 45 fps (H.265/H.264)
- Gigabit Ethernet port
Overview
SE200ZC-AP is a new generation smart module launched by Quectel. It integrates the Rockchip IoT chip RV1126B /RV1126BJ, featuring a high-performance quad-core ARM Cortex-A53 CPU (integrated with NEON and FPU), a 12 MISP HDR, an 8 M AI-ISP, and a 3 TOPS NPU (supporting mixed operations of INT4/8/16 and FP16). The module alsosupports external Wi-Fi and Bluetooth connectivity. With powerful performance and built-in “sensing – computing –communication” capabilities, it is well-suited to meet customer demands in the field of smart security.
The SE200ZC-AP module integrates a rich set of peripheral interfaces: 1 × MIPI_DPHY/ DVP/ LCDC, 2 × MIPI CSI, 3 ×SAI, 1 × PDM, 2 × DSM, 22 × ADC, 6 × I2C, 1 × GMAC, 1 × USB 3.0, 1 × USB 2.0, 2 × SPI, 2 × CAN FD, 2 × SDIO,8 × UART, etc. The module supports 4K @ 30 fps video decoding (H.265/ H.264) and 4K @ 45 fps video encoding(H.265/ H.264), as well as multi-stream encoding. Coupled with a 3T NPU and a comprehensive suite of deep learningalgorithms, it enables the realization of “sensing – computing – communication” application requirements.Additionally, the module comes preloaded with a Linux*/ Debian* system and supports external Quectel Cat 4/ 1, 4G,Voice, Wi-Fi 6, and GNSS modules. This significantly expands its applicability in the M2M (Machine-to-Machine) field,making it widely suitable for industries such as smart security, smart industry, intelligent vehicles, robotic vision, andsmart home.
