KGM133S Matter, Thread, Zigbee & BLE module
- Matter 1.4, Thread 1.4, Zigbee 3.0, and BLE 6.0 module
- KGM133S: 12.5 mm × 13.2 mm × 2.2 mm
- KGM133S-p: 16.6 mm × 13.2 mm × 2.2 mm
- LGA form factor
- Operating temperature range: -40°C to +105℃
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Key features
- Matter 1.4, Thread 1.4, Zigbee 3.0, BLE 6.0
- 256 KB SRAM and 1536 KB/2.5 MB/3.5 MB flash (optional)
- Thread, Zigbee, BLE mesh networking
- 21 GPIOs which can be used for interfaces including I2C, USART, SPI, I2S, etc.
- Operating temperature range: -40 °C to +105 °C
- 4th generation RF coaxial connector/ pin antenna/ PCB antenna (optional)
Overview
KGM133S is a series of high-performance MCU Thread, Zigbee and BLE module by Quectel. It boasts an ARM Cortex-M33 processor with a frequency of up to 78 MHz, and supports Matter, Thread, Zigbee, BLE 6.0, and BLE mesh. The module features built-in 256 KB SRAM and 1536 KB/ 2.5 MB/ 3.5 MB flash, ensuring efficient performance.
KGM133S series is in an LGA form factor with an ultra-compact size, which optimizes the size and cost for end-products and is compatible with diverse designs.
The module normally supports 21 GPIOs, and up to 26 GPIOs under special configurations, which can be used as interfaces including I2C, USART, SPI and I2S. It also features a superior sensitivity of -105 dBm and a transmit power of up to +19.5 dBm (optional), providing flexibility and versatility for a range of applications.
The module supports standard Thread, Zigbee or Bluetooth mesh networking, increasing network scalability and node counts. It is suitable for applications that require many-to-many communication, such as low-power devices, smart lighting, smart buildings and home smart wireless networks. In addition, KGM133S series offers an enhanced security option Secure Vault, providing a higher level of IoT security.
