HCM131XN MCU BLE 6.0 module
- BLE 6.0 module
- 19.0 mm × 13.0 mm × 2.2 mm
- LCC form factor
- Operating temperature range: -40°C to +105°C
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Key features
- BLE 6.0 (Channel Sounding), Thread, Zigbee
- 256KB RAM, 1.5MB flash
- ARM Cortex-M33 processor and RISC-V coprocessor (up to 128 MHz)
- Supports up to 31 GPIOs, which can be multiplexed as various interfaces including I2S, UART, I2C, SPI, and NFC
- Max. transmit power: +7 dBm
- Pin antenna interface, 1st generation RF coaxial connector, PCB antenna (optional)
- Operating temperature range: -40°C to +105°C
Overview
The HCM131XN is a high-performance MCU module, supporting BLE 6.0 (Channel Sounding), Thread, and Zigbee, launched by Quectel. It boasts an ARM Cortex-M33 processor core and a RISC-V coprocessor with a frequency of up to 128 MHz. It features built-in 256 KB RAM and 1.5 MB flash, ensuring efficient performance.
The HCM131XN is in LCC form factor, with an ultra-compact size of 19.0 mm × 13.0 mm × 2.2 mm, which optimizes the size and cost for end-products and is compatible with diverse designs.
The HCM131XN can support up to 31 GPIOs, which can be multiplexed as various interfaces including I2S, UART, I2C, SPI, and NFC. It also features a superior sensitivity of -96 dBm and a transmit power of up to +7 dBm, providing flexibility and versatility for a range of applications.
The HCM131XN features ultra-low power consumption and is suitable for applications such as smart home, asset labels and beacons, portable medical devices, and battery-powered sensor products.
Product Brochure
Quectel_Product_Brochure_V8.6.pdf
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