Wi-Fi & Bluetooth FME163R
- Wi-Fi 6 module
- Max data rate of 1201 Mbps
- M.2 2230 KEY-E package
- 22.0 mm × 30.0 mm × 2.85 mm
- 2.28 g
- Temperature ranges of -20°C to +70°C or -40°C to + 85°C
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Key features
- 2.4 GHz/5 GHz Wi-Fi bands and Bluetooth 5.2
- PCIe 1.1 interface, with higher data transmission rate and lower power consumption
- Faster time-to-market: simple design minimizes design-in time and development efforts
- Wide temperature range: -20°C to +70°C or -40°C to + 85°C (optional)
Overview
The FME163R is a high-performance Wi-Fi 6 and Bluetooth 5.2 module launched by Quectel, which can be used for WLAN and Bluetooth connections. With its compact size of 22.0 mm × 30.0 mm × 2.85 mm, the module fits into the M.2 2230 Key-E package and is easy to integrate into the host device. It can also effectively lower production cost, increase production efficiency, and fulfil the demands of complicated environments.
FME163R supports 2 × 2 MIMO with a maximum physical layer data transmission rate of 1201 Mbps.
Based on the reliable PCIe 1.1 interface, the FME163R achieves low-power and high-speed data transmission. Coupled with its higher power consistency and accuracy and ultra-wide temperature range, the module can meet the requirements of industries, consumer goods and laptop applications.
Simplify deployment by sourcing antennas at the same time as your modules – see our wide range here
Product Brochure
Quectel_Product_Brochure_V8.3.pdf
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