Wi-Fi & Bluetooth FLM140D
- 2.4GHz single band Wi-Fi 4 and BLE 5.2 module
- DIP form factor
- 17.91mm × 14.99mm × 2.8mm
- 0.83g
- Operating temperature: -40°C to +85°C
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Key features
- Wi-Fi 4 module, single band (2.4 GHz) Wi-Fi, 1 × 1 antenna
- BLE 5.2 and Wi-Fi pairing via Bluetooth
- Large memory – 256KB RAM, 2MB or 4MB flash
- Supports UART, GPIO, ADC and PWM interfaces
- PCB antenna
- High stability, high reliability and full compatibility
Overview
FLM140D is a cutting-edge MCU Wi-Fi and Bluetooth module launched by Quectel. It boasts a high-performance processor with a frequency of up to 120MHz and supports IEEE 802.11b/g/n protocol and BLE 5.2. The module features built-in 256KB RAM, 2MB or 4MB flash, ensuring efficient performance. In addition, it complies with WPA-PSK, WPA2-PSK and WPA3-SAE security standards.
FLM140D is in a DIP form factor with an ultra-compact package size of 17.91mm × 14.99mm × 2.8 mm, which optimizes the size and cost for end-products and is compatible with diverse designs.
The FLM140D module supports multiple interfaces including UART, GPIO, ADC and PWM, and many low power consumption modes and keep-alive mechanisms, which provide flexibility and versatility for a range of applications, especially in smart homes and industrial IoT scenarios. Especially suitable for smart sockets and other small volume, high temperature IoT devices. The FLM140D module supports the QuecOpen® solution and has a compact protocol stack, allowing for efficient product development.
