Wi-Fi & Bluetooth FCU760K
- Wi-Fi 6 and Bluetooth 5.4 module
- Max. data rate of 600.5Mbps
- LCC form factor
- 13.0mm × 12.2mm × 2.0mm
- 0.62g
- Operating temperature range of -20°C to +80°C
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Key features
- 2.4GHz/5GHz Wi-Fi bands and Bluetooth 5.4
- Wi-Fi/Bluetooth antenna 1 ×1
- USB 2.0 interface which features higher data transmission rate and lower power consumption
- LCC package, convenient for welding
- Faster time-to-market: simple design minimizes design-in time and development efforts
- Wide operating temperature range: -20°C to +80°C
Overview
FCU760K is a high-performance Wi-Fi 6 and Bluetooth 5.4 LCC package module launched by Quectel, which can be used for WLAN and Bluetooth connections. The module complies with IEEE 802.11a/b/g/n/ac/ax protocol, supports up to 11ax MCS 11 rate at 80 MHz channel, and the transmission rate can reach 600.5 Mbps. FCU760K adopts reliable USB 2.0 interface design and supports WLAN/Bluetooth high speed transmission.
With an ultra-compact size of 13.0 mm × 12.2 mm × 2.0 mm, FCU760K optimizes the size and cost for end-products, which fully meets the demands of size-sensitive applications.
Surface-mount technology (SMT) makes FCU760K an ideal solution for durable and rugged designs. The low profile and small size of LCC package ensure that FCU760K can be easily embedded into size-constrained applications and provide reliable connectivity with these applications. The advanced package, integrated shielding cover and the laser-engraved label with better heat dissipation and indelible markings allow for large-scale automated manufacturing that has strict requirements on cost and efficiency. Coupled with its compact size and wide operating temperature range, FCU760K can meet various needs of commercial and industrial applications.
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Product Brochure
Quectel_Product_Brochure_V8.4.pdf
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