Wi-Fi & Bluetooth FCE860X
- Wi-Fi 6 and Bluetooth 5.4 module
- Max. data rate up to 1201Mbps
- 15.0mm × 13.0mm × 2.0mm
- Operating temperature range: -20°C to +80°C or -40°C to +85°C
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Key features
- 2.4GHz and 5GHz Wi-Fi bands and Bluetooth 5.4
- PCIe 2.0 interface that supports higher data transmission rate and enables lower power consumption
- Faster time-to-market: simple design minimizes design-in time and development efforts
- Wider operating temperature range: -20°C to +80°C or -40°C to +85°C
Overview
The FCE860X is a high-performance Wi-Fi 6 and Bluetooth 5.4 module featuring 2T2R in LCC package. It can be used for WLAN and Bluetooth connections, delivering a maximum data rate of 1201Mbps.
With an ultra-compact size of 15.0mm x 13.0mm x 2.0mm, the module optimizes the size and cost for end-products, which fully meets the demands of size-sensitive applications.
Surface-mount technology (SMT) makes the module an ideal solution for durable and rugged designs. The low profile and small size of LCC package ensure that the module can be easily embedded into size-constrained applications and provide reliable connectivity in these applications.
Based on the reliable PCIe 2.0 interface, the module enables high-speed, low-power WLAN wireless transmission. With its compact form factor, low power consumption, wide temperature range, and high reliability, the FCE860X is ideally suited for consumer applications.