Wi-Fi 6 & Bluetooth 5.2 AF55C automotive module
- Automotive grade Wi-Fi 6 and Bluetooth 5.2 module
- Dimensions: 19.5 mm x 21.5 mm x 2.85 mm
- LGA form factor
- 1200 Mbps max. data rate
- Operating temperature range: -40 °C to +85 °C
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Key features
- Automotive grade Wi-Fi and Bluetooth module supporting 2.4 GHz and 5 GHz Wi-Fi and Bluetooth 5.2
- Supports 2 x 2 MIMO
- PCIe 2.0/SDIO interface, which provides a higher data transmission rate and lower power consumption
- Ideal for automotive market applications with IATF 16949: 2016 requirement. Compliant with automotive quality processes such as APQP and PPAP.
- Wide operating temperature range meets the demanding requirements of automotive devices
- Fast time to market: simple design minimizes design-in time and development efforts
Overview
The AF55C is an automotive grade Wi-Fi 6 and Bluetooth 5.2 module with high performance, supporting 2 x 2 MIMO. It is designed to be used together with Quectel automotive AG56xN family modules to establish WLAN and Bluetooth connections.
With a compact and unified form factor of 19.5 mm x 21.5 mm x 2.85 mm, the AF55C is an ideal Wi-Fi/Bluetooth solution for size-sensitive applications and helps customers reduce product size and to optimize application design costs. The surface-mount technology enhances its durability and robustness, and the LGA package makes sure the module can be easily embedded into size-constrained applications and provide reliable connectivity in these applications. The advanced package allows for large-scale automated manufacturing which has strict requirements on cost and efficiency.
Designed with a reliable PCIe 2.0/SDIO interface to provide WLAN capability, the AF55C achieves low-power and high-speed data transmission. Coupled with its compact size and wide temperature range, the AF55C meets Wi-Fi/Bluetooth + LTE-A/5G application design requirements in the automotive industry.
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Product Brochure
Quectel_Product_Brochure_V8.4.pdf
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