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UMTS/HSPA+ UC200A-GL

  • UMTS/HSPA+ module
  • LCC form factor
  • 29.0mm × 32.0mm × 2.4mm
  • Max. data rates of 21Mbps downlink and 5.76Mbps uplink
  • Operating temperature: -35°C to +75°C
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Key features

  • Worldwide UMTS/HSPA+ and GSM/GPRS/EDGE coverage
  • Dual-mode and multi-band for UMTS & GSM
  • Low design cost
  • High-performance and multi-feature interfaces
  • High-quality data and image transmission even in harsh conditions
  • Compatible with multiple LTE standard modules in package

Overview

Quectel UC200A-GL is a cost-effective and high-performance UMTS/HSPA+ module with data rates of up to 21Mbps downlink and up to 5.76Mbps uplink. UC200A-GL is compatible with LTE standard EC2x series (EC25 series and EC21 series), EC200U series, EC20-CE, EC200D-CN and EC200N-CN in SMT package, which ensures a smooth transition between 3G and 4G networks. In addition, UC200A-GL is also fully backward compatible with existing GSM/GPRS/EDGE networks.

UC200A-GL is suited for global networks in UMTS/HSPA+ connectivity and adopts the laser engraving process to ensure a good-looking appearance, strong metallic texture, better heat dissipation and durable label information, which makes it more suitable for automation requirements.

A rich set of internet protocols, industry-standard interfaces and abundant functionalities (USB drivers for Windows 7/8/8.1/10/11, Linux and Android) enable the module to serve a wide range of M2M applications, such as automation, smart metering, tracking systems, security solutions, routers, wireless POS, mobile computing devices, PDA phones and tablet PCs.

Simplify deployment by sourcing antennas at the same time as your modules – see our wide range here

Product Brochure

Quectel_Product_Brochure_V8.3.pdf

Download

Documentation and resources

  • Quectel_UC200A-GL_QuecCell_Application_Note_V1.0

    306.48 KB

    Quectel_UC200A-GL_RF_FTM_Application_Note_V1.0

    183.18 KB

  • Quectel_UC200A-GL_Hardware_Design_V1.1

    1.91 MB

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