Wi-Fi & Bluetooth FLM263D series
- 2.4 GHz single band Wi-Fi 6 and BT 5.2 module
- LCC form factor
- 17.3 mm × 15.0 mm × 2.8 mm
- 0.9 g
- Operating temperature range of -40°C to +105°C
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Key features
- Wi-Fi 6 module, 2.4GHz, single band (2.4 GHz)
- BLE 5.2 and Bluetooth-assisted Wi-Fi provisioning
- PCB antenna or RF coaxial connector (IPEX Gen 4) (optional)
- Large memory – 512KB SRAM and 4MB flash
- Wide operating temperature range: -40°C to +105°C
- High stability, high reliability and full compatibility
Overview
FLM263D series is a high cost-performance MCU Wi-Fi 6 and Bluetooth module launched by Quectel. It has a built-in32-bit RISC-V processor with frequency up to 320 MHz and supports IEEE 802.11b/g/n/ax protocol and BLE 5.2. The module features 512 KB SRAM and 4 MB flash, complies with WPA-PSK, WPA2-PSK, and WPA3-SAE standards,integrates the Mbed TLS library, and supports the Secure Boot mechanism.
FLM263D series contains two variants: FLM263D and FLM263D-L*. The module features a stamp-hole LCC SMD package compatible with through-hole soldering. With ultra-compact size of 17.3 mm × 15.0 mm × 2.8 mm, it best meets end-product demand for compact-sized modules and is compatible with diverse structural designs.
The module supports ADC, PWM and UART functions in QuecOpen® solution, and many low power modes and keep alive mechanism, which provide flexibility and versatility for a range of applications, such as smart homes, industrial IoT, consumer electronics and other scenarios to meet various product needs. It is especially suitable for small-sized,high temperature-operating IoT devices, such as light bulbs.
FLM263D series integrates the ACK SDK for Matter solution, which enables terminal products to quickly and efficiently access the Amazon Alexa platform and can be interconnected with other smart devices that support the Matter protocol.
