Easier soldering and testing process with LCC package
Stable and reliable SDIO communication interface
Fast time-to-market: simple design minimizes design-in time and development efforts
Quectel FC21 is a cost-effective, high performance Wi-Fi & Bluetooth module. Designed in an ultra-compact LCC package measuring 16.6mm × 13.0mm × 2.05mm, it is optimal for size-sensitive applications, and surface-mount technology makes it ideal for durable and rugged designs. The low profile and small size the FC21 mean it can be easily embedded into size-constrained applications to provide reliable connectivity. The advanced package also meets the strict cost and efficiency requirements of large-scale automated manufacturing.
The FC21 is typically used in combination with Quectel LTE Standard EC21 series, EC25 series, EC20-CE and EG25-G series modules and other application processors (IMX6, IMX8, etc.). The compact form factor, low power consumption, extended temperature range and stable SDIO interface allow the module to serve a wide range of IoT applications such as automotive, security, industrial PDAs, MiFi and healthcare.
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