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UMTS/HSPA+ UG89

  • High-performance UMTS/HSPA+ module
  • 27.6mm × 25.4mm × × 2.35mm
  • LGA package
  • Max. 21Mbps downlink / 5.76Mbps uplink
  • Operating temperature -40°C to +85°C
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Quectel Product Brochure

Quectel Product Brochure V6.6

Documentation and Resources

    • Quectel_UC200T&UG89_Series_PPP_Application_Note_V1.0 Log In
    • Quectel_UC200T&UG89_Series_FILE_Application_Note_V1.0 Log In
    • Quectel_UC200T&UG89_Series_FOTA_Application_Note_V1.1 Log In
    • Quectel_UC200T&UG89_Series_FTM_Application_Note_V1.0 Log In
    • Quectel_UC200T&UG89_Series_Power_Back-off_Application_Note_V1.0 Log In
    • Quectel_UG89_Hardware_Design_V1.0 Log In

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